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Model-based OPC Accelerator
Model-based OPC is a
time-consuming process. Each design is looked at as
though its geometry is unique to the previous design
thus needing the same full consideration. There is no
mechanism that captures geometric placement inferences
from an OPC placement used with a previous design and
then applies the inferences to the second, third,
fourth, designs, etc., even as an approximation.
OPC Learner relies on
empirical inference of complex OPC rules implicit in the
correction process established on a primary mask design.
We begin with an offline analysis where we compare a
golden design file with the golden post-OPC design file. During
the analysis, our method derives implicit, contextual
OPC rules for optimal placement of RET features at that
node.
Following the analysis,
we are able to apply OPC features intelligently to
subsequent designs produced at the same node without the
need to manufacture and project sample masks. Our method
can intelligently apply s-RF's (sub-Resolution
Feature's) such as cuts, jogs, and serifs to new designs
at the same technology node according to the
newly-derived OPC rules. We are able to determine and
apply correct features in a fraction of the time
required by existing methods. The resulting photomasks
are shown under lithographic simulation to produce the
intended on-wafer geometry with the same level of
accuracy as the original model-based method.
The duration of the
off-line analysis depends on the design but can take
about one week. The resulting subsequent placement of
OPC on designs two, three, etc. is 10X faster.
For additional
information about this product, please email us at
inquiries@oasistooling.com.
OPC Learner
is available as evaluation software prior to
purchase. For more information, please go to our software
Evaluation page. |
